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Research note

SK hynix breaks ground on U.S. HBM packaging hub in Indiana

SK hynix broke ground on its West Lafayette, Indiana AI-memory fab, combining next-generation HBM production with an advanced-packaging R&D testbed and targeting U.S. customer supply from the second half of 2029.

Company: SK hynixMedium confidenceReview complete

Evidence snapshot

What the evidence says

Short answer: SK hynix broke ground on its West Lafayette, Indiana AI-memory fab, combining next-generation HBM production with an advanced-packaging R&D testbed and targeting U.S. customer supply from the second half of 2029.

Research as of
2026-09-27
Confidence
Medium
Primary sources
1

Use the dated primary-source trail below for time-sensitive claims. Reported evidence and public interpretation are kept separate.

Change record

What changed

  • The August 27 groundbreaking moved the Indiana project from announced investment toward physical execution.
  • The site is planned to include an HBM production line and Advanced Packaging R&D Testbed on roughly 133 acres.
  • SK hynix targets supply of next-generation HBM packaged and tested on site to U.S. customers beginning in the second half of 2029.

Public interpretation

Why it matters

The project is direct evidence of geographic expansion in HBM and advanced-packaging capacity, but its 2029 supply target means it does not resolve near-term packaging constraints.

Primary-source trail

Evidence