{"schema_version":"1.0","item":{"schema_version":"1.0","id":"ca-note-sk-hynix-indiana-hbm-packaging-2026","slug":"sk-hynix-indiana-hbm-packaging-2026","scope":{"type":"company","slug":"sk-hynix","label":"SK hynix"},"status":"published","published_at":"2026-09-27T07:53:00Z","updated_at":"2026-09-27T07:53:00Z","research_as_of":"2026-09-27","title":"SK hynix breaks ground on U.S. HBM packaging hub in Indiana","summary":"SK hynix broke ground on its West Lafayette, Indiana AI-memory fab, combining next-generation HBM production with an advanced-packaging R&D testbed and targeting U.S. customer supply from the second half of 2029.","what_changed":["The August 27 groundbreaking moved the Indiana project from announced investment toward physical execution.","The site is planned to include an HBM production line and Advanced Packaging R&D Testbed on roughly 133 acres.","SK hynix targets supply of next-generation HBM packaged and tested on site to U.S. customers beginning in the second half of 2029."],"why_it_matters":"The project is direct evidence of geographic expansion in HBM and advanced-packaging capacity, but its 2029 supply target means it does not resolve near-term packaging constraints.","confidence":"medium","evidence":[{"label":"SK hynix: Indiana fab groundbreaking","url":"https://news.skhynix.com/en/indiana-groundbreaking-ceremony-sketch/","source_type":"official_company_announcement","primary":true,"supports":"Groundbreaking, site scope, HBM and advanced-packaging R&D role, and second-half 2029 U.S. supply target.","as_of":"2026-08-28"}],"human_review_status":"approved","url":"https://constraintalpha.com/research/sk-hynix-indiana-hbm-packaging-2026","markdown_url":"https://constraintalpha.com/research/notes/sk-hynix-indiana-hbm-packaging-2026.md"}}