# SK hynix breaks ground on U.S. HBM packaging hub in Indiana

> Constraint Alpha research note. Confidence: medium.

Published: 2026-09-27T07:53:00Z  
Research as of: 2026-09-27  
Scope: company / SK hynix

## Summary

SK hynix broke ground on its West Lafayette, Indiana AI-memory fab, combining next-generation HBM production with an advanced-packaging R&D testbed and targeting U.S. customer supply from the second half of 2029.

## What changed

- The August 27 groundbreaking moved the Indiana project from announced investment toward physical execution.
- The site is planned to include an HBM production line and Advanced Packaging R&D Testbed on roughly 133 acres.
- SK hynix targets supply of next-generation HBM packaged and tested on site to U.S. customers beginning in the second half of 2029.

## Why it matters

The project is direct evidence of geographic expansion in HBM and advanced-packaging capacity, but its 2029 supply target means it does not resolve near-term packaging constraints.

## Evidence

- [SK hynix: Indiana fab groundbreaking](https://news.skhynix.com/en/indiana-groundbreaking-ceremony-sketch/) — Groundbreaking, site scope, HBM and advanced-packaging R&D role, and second-half 2029 U.S. supply target. (as of 2026-08-28)

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Canonical URL: https://constraintalpha.com/research/sk-hynix-indiana-hbm-packaging-2026