# NVIDIA maps the capacity queue beyond HBM

> Constraint Alpha research note. Confidence: medium.

Published: 2026-10-26T05:39:16Z  
Research as of: 2026-10-26  
Scope: company / NVIDIA (NVDA)

## Summary

NVIDIA disclosed dated capacity agreements across substrates, advanced packaging, testing and optical engines on October 21. The figures are supplier targets and reservations, not commissioned or customer-accepted output.

## What changed

- Substrate agreements are intended to support a 2.5× aggregate capacity increase over three years; Amkor targets more than 300% growth in interposer-wafer capacity by end-2028.
- NVIDIA expects testing capacity to double from 2026 to 2027 and disclosed a $1.1 billion advance to KYEC; SPIL targets a 15× optical-engine expansion by mid-2027.

## Why it matters

The disclosure identifies which layers NVIDIA treats as scarce and attaches dates and financing to them. Commissioning, yield, qualification and accepted shipments remain the release tests.

## Evidence

- [NVIDIA: supply-chain capacity agreements](https://nvidianews.nvidia.com/news/nvidia-and-supply-chain-partners-expand-capacity-to-accelerate-ai-infrastructure-buildout) — Quantified substrate, interposer, testing and optical-engine expansion targets and capacity advances; company statements. (as of 2026-10-21)

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Canonical URL: https://constraintalpha.com/research/nvidia-packaging-testing-optics-capacity-2026