{"schema_version":"1.0","item":{"schema_version":"1.0","id":"ca-note-nvidia-packaging-testing-optics-capacity-2026","slug":"nvidia-packaging-testing-optics-capacity-2026","scope":{"type":"company","slug":"nvidia","label":"NVIDIA (NVDA)"},"status":"published","published_at":"2026-10-26T05:39:16Z","updated_at":"2026-10-26T05:39:16Z","research_as_of":"2026-10-26","title":"NVIDIA maps the capacity queue beyond HBM","summary":"NVIDIA disclosed dated capacity agreements across substrates, advanced packaging, testing and optical engines on October 21. The figures are supplier targets and reservations, not commissioned or customer-accepted output.","what_changed":["Substrate agreements are intended to support a 2.5× aggregate capacity increase over three years; Amkor targets more than 300% growth in interposer-wafer capacity by end-2028.","NVIDIA expects testing capacity to double from 2026 to 2027 and disclosed a $1.1 billion advance to KYEC; SPIL targets a 15× optical-engine expansion by mid-2027."],"why_it_matters":"The disclosure identifies which layers NVIDIA treats as scarce and attaches dates and financing to them. Commissioning, yield, qualification and accepted shipments remain the release tests.","confidence":"medium","evidence":[{"label":"NVIDIA: supply-chain capacity agreements","url":"https://nvidianews.nvidia.com/news/nvidia-and-supply-chain-partners-expand-capacity-to-accelerate-ai-infrastructure-buildout","source_type":"company_release","primary":true,"supports":"Quantified substrate, interposer, testing and optical-engine expansion targets and capacity advances; company statements.","as_of":"2026-10-21"}],"human_review_status":"approved","url":"https://constraintalpha.com/research/nvidia-packaging-testing-optics-capacity-2026","markdown_url":"https://constraintalpha.com/research/notes/nvidia-packaging-testing-optics-capacity-2026.md"}}